Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016195292
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To realize a semiconductor device with improved acid resistance and corrosion resistance of a bonding part between a wire and a semiconductor element.SOLUTION: A semiconductor device (10) comprises: a semiconductor chip (1); a circuit board (2); a bonding wire (7) that includes a main metal wire bonded with the semiconductor chip (1) and the circuit board (2), and a coating material for coating at least a part of the main metal wire; a protection resin (5) for coating a bonding part between the main metal wire and a bonding target thereof; and a resin encapsulation body (4).SELECTED DRAWING: Figure 1
Inventors:
MIHARA TAKAYUKI
Application Number:
JP2016165026A
Publication Date:
November 17, 2016
Filing Date:
August 25, 2016
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L21/60
Domestic Patent References:
| JPS5712543A | 1982-01-22 | |||
| JPS6224650A | 1987-02-02 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark