Title:
SEMICONDUCTOR DEVICE AND REINFORCING PLATE THEREOF
Document Type and Number:
Japanese Patent JP3558117
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a durable semiconductor device which is made difficult for cracks to occur in a solder ball and a reinforcing plate used by the semiconductor device.
SOLUTION: At an inflating part 9 of a reinforcing plate 7 with a ceiling part 11 for bonding a semiconductor element, an opening part 15 that releases stresses to both the sides of a ceiling support part 14 for supporting the ceiling part 11 is formed, and the width of the ceiling support part 14 is set to a width capable of varying bending, etc., where deformation such as bending can be made to absorb thermal deformation at a part other than the inflating part 9 of the reinforcing plate 7.
Inventors:
Tatsuya Otaka
Application Number:
JP17992798A
Publication Date:
August 25, 2004
Filing Date:
June 26, 1998
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01L23/12; H01L23/02; H01L23/04; (IPC1-7): H01L23/12
Domestic Patent References:
| JP9022962A | ||||
| JP9326450A | ||||
| JP11186453A | ||||
| JP10340967A |
Attorney, Agent or Firm:
Tadao Hirata
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