Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023181657
Kind Code:
A
Abstract:
To provide a semiconductor device of which the product lifetime can be secured, and provide a manufacturing method of a semiconductor device capable of obtaining a semiconductor device of which the product lifetime is secured.SOLUTION: A semiconductor device 11 comprises a semiconductor element 21, which is a heating element, and a metallic heat spreader 22 which is a heat dissipation member fixed to the semiconductor element 21. The heat spreader 22 includes a plurality of joint end portions separated from each other. The joint end portions are end portions of columns 32A constituting the heat spreader 22. The joint end portions are directly fixed to the semiconductor element 21. The heat spreader 22 is molded in a molding direction, in which a distance from the semiconductor element 21 increases in a direction orthogonal to the semiconductor element 21, utilizing a three-dimensional multilayer molding technique. The joint end portions of the heat spreader 22 are directly fixed to the semiconductor element 21 in a molding step.SELECTED DRAWING: Figure 1
Inventors:
HOSHINO HIROYUKI
YORITSUNE MASASHI
OTSUKA ATSUSHI
YORITSUNE MASASHI
OTSUKA ATSUSHI
Application Number:
JP2022094913A
Publication Date:
December 25, 2023
Filing Date:
June 13, 2022
Export Citation:
Assignee:
JTEKT CORP
International Classes:
H01L23/36
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda