Title:
SEMICONDUCTOR DEVICE HAVING ANTENNA
Document Type and Number:
Japanese Patent JP2024040632
Kind Code:
A
Abstract:
To provide a compact semiconductor device having an antenna.SOLUTION: A semiconductor device having an antenna comprises: a radiator plate having a first surface and a second surface; a semiconductor chip provided on the second surface of the radiator plate; a wiring board having a first board surface provided on the first surface of the radiator plate and a second board surface provided on the opposite side to the first board surface, the wiring board being formed from laminating a resin insulation layer and a metal wiring layer, the wiring board covering side surfaces of the radiator plate and the semiconductor chip and a circuit surface located on the opposite side to the radiator plate of the semiconductor chip, and exposing the first surface of the radiator plate to the first board surface; and an antenna provided on the second broad surface of the wiring board. The wiring board comprises a board connector provided on the first board surface, a first wiring line connecting the board connector and a first terminal provided on the circuit surface of the semiconductor chip, and a second wiring line connecting the antenna and a second terminal provided on the circuit surface of the semiconductor chip.SELECTED DRAWING: Figure 1
Inventors:
IKEDA JUNYA
NAKADA YOSHIHIRO
SASAKI SHINYA
NAKADA YOSHIHIRO
SASAKI SHINYA
Application Number:
JP2022145101A
Publication Date:
March 26, 2024
Filing Date:
September 13, 2022
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L25/00; H01L23/12; H01L23/36
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Koichi Hirota
Tadahiko Ito
Koichi Hirota