To eliminate the need for using a support, even when an external connection terminal is positioned outside the external edge of a semiconductor chip.

A semiconductor device 40 has an insulating member 16, which is made smaller than a semiconductor chip 14 and adhered to an electrode terminal formation surface 14a of the chip, so that an electrode terminal 32 is exposed, a tape substrate 12 which is made larger than the chip 14 and adhered onto an insulating member 16, so that the electrode terminal 32 is exposed through a formed slit and the peripheral edge part extend to outside the external edge of the chip 14, a wiring pattern 22 which is formed on the tape substrate 12 on the surface side of adhesion to the insulating member 16 and formed at a lead part 28 having one end side at a land part 24 for external connection terminal connection outside the external edge of the chip 14 and the other end side connected to the electrode terminal 32, and a resin sealing part 20, which seals the exposed surface of the tape substrate 12 on the side of the insulating member 16, a flank 14b of the chip and the formation surface 14a of the electrode terminal, the exposed surface of the insulating member 16, and the area inside the slit.