Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001110988
Kind Code:
A
Abstract:
To prevent a shortage of mounting area of an electronic component, which is caused by highly functional progress in system, when mounting an electronic component on a circuit board.
In a mold package type semiconductor device, each wiring 17 or 18 to be connected to a lead 12 or 13 and each electrode 19 or 20 to be connected to the wiring 17 or 18 are formed on a surface of a package 10. By connecting an electronic component 2 to the electrode 19 or 20, the number of components mounted on the circuit board can be reduced.
Inventors:
TORASAWA HIROYASU
Application Number:
JP28369299A
Publication Date:
April 20, 2001
Filing Date:
October 05, 1999
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L25/18; H01L25/10; H01L25/11; (IPC1-7): H01L25/10
Attorney, Agent or Firm:
Toshiaki Suzuki