Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020074352
Kind Code:
A
Abstract:
To provide a semiconductor device which can suppress wet spreading of solder while improving connection strength of a solder bump.SOLUTION: In a semiconductor device 10A, a first resin interlayer film 105 is formed on a semiconductor substrate 106. A wiring electrode 107 is formed on the first resin interlayer film 105. A second resin interlayer film 104 has a first opening 104a exposing a portion of the wiring electrode 107 and covers the wiring electrode 107. An underbump metal 102 covers an inner surface and an upper edge of the first opening 104a and is connected to the wiring electrode 107 exposed from the first opening 104a. A passivation film 103 has a second opening 103a exposing a portion of the underbump metal 102, covers at least a portion of an outer edge 202 of the underbump metal 102 located on the second resin interlayer film 104 and formed on the second resin interlayer film 104. A solder bump 101 is connected to the underbump metal 102 exposed from the second opening 103a.SELECTED DRAWING: Figure 1
Inventors:
OKA TAKAFUMI
NISHIGUCHI KOHEI
NISHIGUCHI KOHEI
Application Number:
JP2017047434A
Publication Date:
May 14, 2020
Filing Date:
March 13, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita