Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022114045
Kind Code:
A
Abstract:
To provide a semiconductor device compatible with both packages regardless of whether double bonding of lead frame pads is possible.SOLUTION: The semiconductor device includes: an operational amplifier 2; a feedback resistance 6; a reference voltage generating circuit 7; an output transistor 5; a first pad 3a connected to the output terminal of the output transistor 5 and selectively connected to a lead frame pad 10 by a bonding wire 4a; a second pads 3b selectively connected to the lead frame pad 10 by a bonding wire 4b; and a connection switching element 8 provided between the first pad 3a and the second pad 3b. When the second pad 3b is connected to the lead frame pad 10 by the bonding wire 4b, the connection switching element 8 disconnects the first pad 3a from the second pad 3b.SELECTED DRAWING: Figure 1
Inventors:
SUN HAIDONG
Application Number:
JP2021010154A
Publication Date:
August 05, 2022
Filing Date:
January 26, 2021
Export Citation:
Assignee:
ABLIC INC
International Classes:
G05F1/56; H01L21/50; H01L21/822
Previous Patent: JPWO2022114044
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