Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3822321
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To control growth of bubbles or cracks during a heat cycle to improve the reliability by specifying the loss elasticity modulus and complex elasticity modulus of a silicone gel for sealing or filling semiconductor elements in a case.
SOLUTION: The semiconductor device comprises a semiconductor element 1 sealed or filled with a silicone gel 6 in a case 5. The gel 6 has a loss modulus of elasticity 1.0×103-1.0×105 dyn/cm2 at shearing frequency of 0.1 Hz, 25°C and complex modulus of elasticity 1.0×106 dyn/cm2 or less. If the device sealed or filled with the gel 6 having such elastic modulus ranges is subjected to a heat cycle, the creation of fubbles or cracks in the gel 6 is suppressed to avoid deteriorating the electric characteristics such as dielectric breakdown strength, etc., to provide a high reliability.
Inventors:
Hiroshi Gangnam
Yuji Hamada
Akihiro Nakamura
Yuji Hamada
Akihiro Nakamura
Application Number:
JP20868797A
Publication Date:
September 20, 2006
Filing Date:
July 17, 1997
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08L83/04; H01L23/28; C08G77/04; H01L23/29; H01L23/31; (IPC1-7): H01L23/28; C08G77/04; C08L83/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP6234922A | ||||
| JP62149157A | ||||
| JP63246856A |