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Title:
半導体装置
Document Type and Number:
Japanese Patent JP5296116
Kind Code:
B2
Inventors:
Kazuhiko Fukuda
Kenji Toyosawa
Kidoguchi
Application Number:
JP2011030965A
Publication Date:
September 25, 2013
Filing Date:
February 16, 2011
Export Citation:
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Assignee:
Sharp Corporation
International Classes:
H01L23/29; C08K5/3492; C08L101/00; H01L21/60; H01L23/31; H05K3/28
Domestic Patent References:
JP2001127216A
JP2001237006A
JP2001257451A
JP5028835A
JP10321994A
JP1251785A
JP2276112A
JP2135764A
JP9071635A
JP2000086911A
JP2002270652A
JP2003023035A
JP2003092379A
JP8231315A
JP58055469A
JP63234013A
JP63209836A
JP63105080A
JP2002302534A
JP61053332A
JP11145626A
JP2004131591A
JP1155683A
JP5160556A
JP2003318177A
JP2004006459A
JP2002201448A
JP2003025470A
JP2003152301A
Foreign References:
WO2000002091A1
Attorney, Agent or Firm:
Kenzo Hara International Patent Office



 
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