Title:
半導体装置
Document Type and Number:
Japanese Patent JP7009231
Kind Code:
B2
Abstract:
To efficiently radiate heat of a local heating part in a semiconductor module and to improve pumping-out resistance while suppressing time and effort or cost increase due to structural additional processing or the like.SOLUTION: A semiconductor device has a semiconductor module, a first grease and a second grease. The semiconductor module seals a semiconductor chip. The first grease is applied to an area overlapping with the semiconductor chip in a heat radiation surface of the semiconductor module. The second grease has a lower consistency than the first grease, and may have lower thermal conductivity than the first grease, and is applied around the area to which the first grease is applied, in the heat radiation surface of the semiconductor module.SELECTED DRAWING: Figure 3
Inventors:
Koichi Yamakawa
Application Number:
JP2018011832A
Publication Date:
January 25, 2022
Filing Date:
January 26, 2018
Export Citation:
Assignee:
Canon Medical Systems Corporation
International Classes:
H01L23/36; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| JP2016054220A | ||||
| JP2008280516A | ||||
| JP2016054223A |
Attorney, Agent or Firm:
Masatoshi Kurata
Nobuhisa Nogawa
Ryuji Mine
Naoki Kono
Tadashi Inoue
Ken Ukai
Nobuhisa Nogawa
Ryuji Mine
Naoki Kono
Tadashi Inoue
Ken Ukai