PURPOSE: To maintain airtightness between a substrate and a cap, even if the difference of thermal expansion coefficient exists, and enable the selection of high thermal conductive material such as Cu and Ag for the cap, by bringing the cap into close contact with a junction part surrounding the substrate, via fiber composite material wherein fibers are arranged at least in the peripheral direction of the junction part.
CONSTITUTION: In fiber composite material 16, fibers 14 are arranged in the layer type from a ceramic multilayer board 3 side to a high C quantity part 13, a medium C quantity part 12 and a low C quantity part 11. The fiber 14 is constituted in the manner in which a fiber 1 composed of, e.g., C is arranged in copper 15. A gap between the material 16 and the ceramic multilayer board 3 is joined with solder via an Au layer 7, and a gap between the material 16 and a cap 4 is joined via Ag solder 5.
OGIWARA SATORU
SOGA TASAO
MORIHARA ATSUSHI
