PURPOSE: To improve the reliability on moisture resistance by sealing the semiconductor element, using an epoxy resin composition, which contains the main agent ingredients consisting of specific epoxy resin and hardening agent ingredients.
CONSTITUTION: A semiconductor element is sealed using an epoxy resin composition, which contains the main agent ingredients consisting of epoxy resin where at least one part is expressed by formula I and hardening agent ingredients. Among the formula I, (n) is an integer of 0-6. The epoxy resin composition being used is one which is gotten using the main agent ingredients consisting of special epoxy resin the whole or one part of which is expressed by the formula I and hardening agent ingredients, and usually it is in the shape of powder or tablet where it is smashed. Hereby, the low moisture adsorption promotion of the epoxy resin composition can realized by the hydrophobic effect of hexafluoropropylene group.
NAGASAWA TOKU
USUI HIDEYUKI
KITAMURA FUJIO
NISHIOKA TSUTOMU
KIMURA HIDETO
