PURPOSE: To secure moisture resistance by arranging first resin at the periphery of the under face of a chip part, and arranging second resin smaller in permittivity than it inside the first resin.

CONSTITUTION: First resin 5 is arranged at the periphery of the under face of a chip part 4, which includes a section where a bump electrode 1 is formed, and second resin 6 smaller in permittivity than the first resin 5 is arranged inside the first resin 5 at the under face of a chip part 4. That is, since the first resin 5 for reinforcing the bump electrode 1 exists only at the periphery of the under face of the chip part 4, and the second resin 6 existing at the center of the under face of the chip part 4 is smaller in permittivity than the first resin 5, the influence on the operation of the chip part 4 is small. Hereby, the first resin 5 secures the reliability on the bump electrode 1, and the second resin 6 controls the deterioration of the properties of an arithmetic circuit of the first chip 4 or a signal transmission line 3, whereby the reliability on moisture resistance, etc., can be secured.