To provide a semiconductor device of a structure, wherein the generation of oxidative corrosion of electrodes on a semiconductor element, bonding wires and the like is effectively prevented and the electrical connection of the element with an external electric circuit is ensured.

A semiconductor device is constituted into a structure, wherein a semiconductor element 3 is bonded and fixed on an insulating base body 1 via a bonding agent 5 in the interior of a container 4, which consists of the insulating base body 1 and a cap body 2, the agent 5 consists of a resin and 10 to 300wt.% of a moisture absorbing material consisting of powder of a particle diameter of 20μm or shorter is contained to 100wt.% of a resin in the interior of the agent 5.