Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5248971
Kind Code:
A
Abstract:
PURPOSE: To facilitate design and reduce costs by connecting overlapped patterns by means of a wire in a lead frame.
Inventors:
UCHIDA MASATAKA
Application Number:
JP12502675A
Publication Date:
April 19, 1977
Filing Date:
October 17, 1975
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
H01L21/60; H01L23/48; (IPC1-7): H01L21/60; H01L23/48