Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS57157532
Kind Code:
A
Abstract:
PURPOSE:To economize a material and man-hours by positively positioning a semiconductor and a thermal buffer plate without being brazed and by simple structure. CONSTITUTION:The thermal buffer plates 23, 23' to which through-holes 24-26 are formed and electrode posts with blind holes 24'-26' are disposed onto the Al electrodes 2, 2' of the semiconductor 1. Cylindrical rings 24'', 25'' in ceramics are fixed onto the surface of the semiconductor 1 by Si resin, an Al cylindrical body 26'' is contacted without being fixed, and these cylindrical bodies are inserted into the holes of said three pairs, thus fixing a position. The buffer plate 23 and the electrode post 22 are fastened by the circumferential folding section 29 of the upper buffer plate 23. A surrounding instrument 30 by the electrode post 22 and a Kovar member 27 and a surrounding instrument 30' by the electrode post 22'' and a ceramic member are pressed, and sealed, and positioning is completed. According to this constitution, the brazing of the semiconductor and the thermal buffer plates can be omitted, and the thermal buffer plates are thinned, thermal resistance can be lowered and cost can also be reduced because the buffer plates have no bimetal effect. Positioning is easy, and assembly is easy.
Inventors:
TSUNODA YOSHIAKI
ANDOU MASARU
ANDOU MASARU
Application Number:
JP4171281A
Publication Date:
September 29, 1982
Filing Date:
March 24, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/52; H01L23/48; (IPC1-7): H01L21/58
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