Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS63108727
Kind Code:
A
Abstract:
PURPOSE: To prevent a protection film from being peeled off or cracked, by providing an insulation film so as to cover the side faces of a semiconductor device and so as to reach a substrate.
CONSTITUTION: A semiconductor device is manufactured by a method similar to conventional methods, except that the side faces of a chip is covered with an Si3N4 film 8 up to a surface such that the interface between aluminium 7 and silicon 5 is not exposed. As a result, water is prevented from entering the chip from this part, a protection film is prevented from being peeled off or cracked, and the moisture resistance of the chip can be improved. SiO2 or polyimide may be used instead of Si3N4.
Inventors:
SATSUMA KAZUMASA
Application Number:
JP25448086A
Publication Date:
May 13, 1988
Filing Date:
October 24, 1986
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/318; (IPC1-7): H01L21/318
Attorney, Agent or Firm:
Kenichi Hayase