Title:
半導体装置及び回路装置
Document Type and Number:
Japanese Patent JP4972306
Kind Code:
B2
Abstract:
A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
Inventors:
Akihiro Sato
Tomohiro Sekiguchi
Kiyokazu Kamachi
Tetsuro Sawai
Shunichi Imaoka
Kurokawa Kazunari
Makoto Tsubonoya
Kiyoshi Mita
Yoichi Nabeta
Tomohiro Sekiguchi
Kiyokazu Kamachi
Tetsuro Sawai
Shunichi Imaoka
Kurokawa Kazunari
Makoto Tsubonoya
Kiyoshi Mita
Yoichi Nabeta
Application Number:
JP2005329184A
Publication Date:
July 11, 2012
Filing Date:
November 14, 2005
Export Citation:
Assignee:
ON Semiconductor Trading Limited
International Classes:
H01L23/12
Domestic Patent References:
| JP2004014645A | ||||
| JP2005500685A | ||||
| JP2001274273A | ||||
| JP2002334806A |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation