Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5775707
Kind Code:
B2
Abstract:
An image pickup apparatus 10, which is a semiconductor device, includes a semiconductor chip 20 including a light receiving section 21, a frame-like spacer 30 arranged on the semiconductor chip 20 to surround the light receiving section 21, a transparent flat plate section 40 arranged on the semiconductor chip 20 via the spacer 30 and having a plan view dimension larger than a plan view dimension of the spacer 30 and smaller than a plan view dimension of the semiconductor chip 20, and a reinforcing member 50 for filling a gap between the semiconductor chip 20 and the transparent flat plate section 40 on the outer side of the spacer 30 and having a plan view dimension larger than the plan view dimension of the transparent flat plate section 40 and smaller than the plan view dimension of the semiconductor chip 20.
Inventors:
Ikari Arashi
Application Number:
JP2011044343A
Publication Date:
September 09, 2015
Filing Date:
March 01, 2011
Export Citation:
Assignee:
Olympus Endo Technology America Inc.
International Classes:
H01L23/02; H01L23/10; H01L27/14
Domestic Patent References:
| JP2006135318A | ||||
| JP2007165495A | ||||
| JP2004296740A | ||||
| JP6350070A |
Foreign References:
| US20070075236 |
Attorney, Agent or Firm:
Susumu Ito