Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4029278
Kind Code:
B2
Inventors:
Hiroyuki Fukasawa
Application Number:
JP2002163212A
Publication Date:
January 09, 2008
Filing Date:
June 04, 2002
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/28; H01L23/29; H01L21/56; H01L23/31; H01L25/04; H01L25/18
Domestic Patent References:
| JP8259895A | ||||
| JP9172137A | ||||
| JP2001332654A | ||||
| JP7007134A | ||||
| JP2002076237A |
Attorney, Agent or Firm:
Osamu Matsumura