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Patent Searching and Data


Title:
半導体装置およびその作製方法
Document Type and Number:
Japanese Patent JP4437523
Kind Code:
B2
Inventors:
Naoki Makita
Misako Nakazawa
Hideto Onuma
Application Number:
JP2002342851A
Publication Date:
March 24, 2010
Filing Date:
November 26, 2002
Export Citation:
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Assignee:
Semiconductor Energy Laboratory Co., Ltd.
Sharp Corporation
International Classes:
H01L21/20; H01L27/08; H01L21/322; H01L21/336; H01L29/786
Domestic Patent References:
JP9205213A
JP2002305148A
JP2004158564A