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Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP4922753
Kind Code:
B2
Abstract:
A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench and contains an impurity of the same conductive type; a semiconductor FIN buried in the trench and provided between the source and drain regions; a gate insulating film provided on a side surface of the semiconductor FIN as well as the upper surface of the semiconductor FIN; and a gate electrode formed on the gate insulating film.

Inventors:
Junko Iwanaga
High Ki Tsuyoshi
Yoshihiko Kanzawa
Karuta Haruyuki
Tetsu Saitoh
Takahiro Kawashima
Application Number:
JP2006507677A
Publication Date:
April 25, 2012
Filing Date:
March 19, 2004
Export Citation:
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Assignee:
Panasonic Corporation
International Classes:
H01L27/088; H01L21/336; H01L21/8234; H01L29/423; H01L29/78; H01L29/786
Domestic Patent References:
JPH06302818A1994-10-28
JPH1168069A1999-03-09
JPH05167043A1993-07-02
JPS6276734A1987-04-08
JP2002110963A2002-04-12
JPH05110083A1993-04-30
JPS63131565A1988-06-03
JP2002118255A2002-04-19
Foreign References:
US4996574A1991-02-26
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura



 
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