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Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5155989
Kind Code:
B2
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Inventors:
Kunimi Hitoshi
Hiromi Fujita
Shinichiro Akiyama
Application Number:
JP2009271963A
Publication Date:
March 06, 2013
Filing Date:
November 30, 2009
Export Citation:
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Assignee:
Asahi Kasei Electronics Co., Ltd.
International Classes:
H01L23/29; C08G69/26; H01L21/56; H01L23/31
Domestic Patent References:
JP2003163380A
JP11035915A
JP2009128550A
JP2005327859A
Foreign References:
WO2010092824A1
Attorney, Agent or Firm:
Tetsuya Mori
Yoshiaki Naito
Hide Tanaka Tetsu



 
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