Title:
SEMICONDUCTOR ELEMENT HOUSING PACKAGE
Document Type and Number:
Japanese Patent JPH0613480
Kind Code:
A
Abstract:
PURPOSE: To readily connect a package to other devices by a method wherein a connector is integrally formed in a package body having a semiconductor element housing part.
CONSTITUTION: A semiconductor element housing package 1 mounted on a circuit board has a connector. Herein, for example, a female type connector mounted at one end of a flat cable extending from the other circuit board is fitted into a connector 3. At this time, as the connector 3 has a guide 11, the female type connector of the flat cable is readily engaged. The guide 11 can prevent a connecting pin 10 from being deformed by an outer force. Thus, it is possible to be readily connected with the other device.
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Inventors:
YOSHIHARA KAZUHIKO
NIITOME JUNICHI
NIITOME JUNICHI
Application Number:
JP16780692A
Publication Date:
January 21, 1994
Filing Date:
June 25, 1992
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/04; H01L23/12; H01L23/32; H01L23/50; (IPC1-7): H01L23/04; H01L23/12; H01L23/32; H01L23/50
Attorney, Agent or Firm:
Yukio Ono (1 person outside)
Next Patent: ゴキブリ駆除器