Title:
半導体装置、パワーモジュールおよび電源装置
Document Type and Number:
Japanese Patent JP7164545
Kind Code:
B2
Abstract:
The semiconductor apparatus includes: a thermal source TS including a semiconductor device generating heat in an operating state; a thermal diffusion unit thermally connected to the thermal source TS, the thermal diffusion unit including space in a direction opposite to the thermal source; a plurality of air-cooling fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit; and a base unit connected to the thermal diffusion unit, wherein the plurality of air-cooling fin units is connected to the base unit through a plurality of thermal contact units CP1, CP2, CP3, . . . , CPn. Provide is an air-cooling type semiconductor apparatus, power module, and power supply, each having high heat dissipation performance and realizing light weight.
Inventors:
Keisuke Wakamoto
Application Number:
JP2019556101A
Publication Date:
November 01, 2022
Filing Date:
August 20, 2018
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/07; H01L23/36; H01L25/18
Domestic Patent References:
| JP10270616A | ||||
| JP2015007162A | ||||
| JP2003158227A | ||||
| JP2004071636A | ||||
| JP2002093967A | ||||
| JP2016072618A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Keishin Terayama
Keishin Terayama
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