To provide a semiconductor inspection apparatus and semiconductor inspection method for reducing inspection time at the time of high-temperature inspection, and shortening the temperature rising time until the inspection start for a standby wafer to be inspected next.
A heating solvent circulator 17 which circulates heating solvent 13 is formed on an inspection stage 15. A solvent heating equipment 14, such as an electric heating wire 14a, which heats the heating solvent 13, and a heating solvent circulating equipments 11, 12 which circulate the heating solvent 13, which was heated with the solvent heating equipment 14, in the inspection stage 15 are provided. By using this constitution, the heated heating solvent 13 is circulated at the heating solvent circulator 17 inside the inspection stage 15, the inspecting object 16 together with the inspection stage 15 can be heated and the temperature is raised. Since the solvent heating equipment 14 can be located in a place distant from the inspection stage 15 and the inspection stage 15 is heated by the heating solvent 13, the inspecting object 16 may not influenced by the electromagnetic wave in this constitution and there is no need of inspection disruption at the time of heating of the inspecting object 16 even if the electric heat wire 14a, as an example, is used as the solvent heating equipment 14.
Toshiji Sasahara
Yohei Harada
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