Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP5866415
Kind Code:
B2
Inventors:
Yusuke Kanno
Hiroyuki Mizuno
Yoshihiko Yasu
Takeshi Hirose
Takahiro Irita
Hiroyuki Mizuno
Yoshihiko Yasu
Takeshi Hirose
Takahiro Irita
Application Number:
JP2014134593A
Publication Date:
February 17, 2016
Filing Date:
June 30, 2014
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/822; G06F1/30; H01L21/82; H01L27/04; H03K19/00
Domestic Patent References:
| JP11191611A | ||||
| JP2000151379A | ||||
| JP2003218682A | ||||
| JP2003168735A | ||||
| JP2005011166A |
Attorney, Agent or Firm:
Yamato Tsutsui