Title:
SEMICONDUCTOR INTEGRATED CIRCUIT AND PROGRAM FOR DESIGNING THE SAME
Document Type and Number:
Japanese Patent JP2008235626
Kind Code:
A
Abstract:
To provide a semiconductor integrated circuit which can increase a possibility of arranging multi-cut vias.
A semiconductor integrated circuit 1 includes a single-cut via 60 and a multi-cut via 30 including first and second vias 30a, 30b. An overhang (OHa or OHb) for at least one of the first and second vias 30a, 30b is smaller than an overhang OH for the single-cut via 60.
Inventors:
NISHIMUTA KEIICHI
Application Number:
JP2007074005A
Publication Date:
October 02, 2008
Filing Date:
March 22, 2007
Export Citation:
Assignee:
NEC ELECTRONICS CORP
International Classes:
H01L21/82
Attorney, Agent or Firm:
Minoru Kudo
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