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Title:
SEMICONDUCTOR LASER-EXCITED SOLID LASER EQUIPMENT
Document Type and Number:
Japanese Patent JP3338714
Kind Code:
B2
Abstract:

PURPOSE: To restrain output fluctuation and obtain stable output, by arranging one surface of a metal block and the facing surface of Nd:YVO crystal so as to be in contact with each other, and thermally coupling them.
CONSTITUTION: A semiconductor laser chip 11 is bonded to the heat absorbing plate of a thermoelectric cooling element 13 via a copper made metal block 12 by using thermally conducting adhesive agent. The metal block 12 is fixed to an optical cabinet 16 so as to be in surface-contact with Nd:YVO4 crystal 14 by using screws. The semiconductor laser pumping light incidence surface where the temperature rises most in the Nd:YVO4 crystal 14 by absorbing semiconductor laser pumping light is in contact with the surface of the metal block 12 whose surface temperature is controlled to be constant by the thermoelectric cooling element 13. Hence the temperature of the semiconductor laser pumping light incidence surface of the Nd:YVO4 crystal 14 becomes equal to the temperature of the metal block 12, and is always controlled to be constant by the thermoelectric cooling element 13, so that the output fluctuation of a solid laser equipment is restrained and stable output can be obtained.


Inventors:
Teruo Kobayashi
Application Number:
JP24555592A
Publication Date:
October 28, 2002
Filing Date:
August 21, 1992
Export Citation:
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Assignee:
Nippon Columbia Co., Ltd.
International Classes:
H01S3/02; H01S3/042; H01S3/094; (IPC1-7): H01S3/042; H01S3/094
Domestic Patent References:
JP4134891A
JP4157777A
JP4209581A
JP462880A
JP2161786A
JP4174577A
JP555670A
JP4283977A
JP5299751A
JP497375U
JP3505948A
Attorney, Agent or Firm:
Minoru Hayashi



 
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