Title:
SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH11312696
Kind Code:
A
Abstract:
To enable a semiconductor device to secure sure joint to a board, without scrubbing in a semiconductor manufacturing equipment and a method of manufacturing a semiconductor device in which a semiconductor element and a board are fixed together with a bonding material.
A semiconductor manufacturing equipment is equipped with an application jig 10A, which is used in a process where a semiconductor element 17 is jointed to a board 15 and applies a bonding material for bonding the semiconductor element 17 to the board 15, wherein the application jig 10A applies and spreads jointing material 13 while it is moved in one direction toward the board 15.
Inventors:
SUMI YUKINORI
YOKOUCHI TAKESHI
YOKOUCHI TAKESHI
Application Number:
JP12108198A
Publication Date:
November 09, 1999
Filing Date:
April 30, 1998
Export Citation:
Assignee:
FUJITSU LTD
FUJITSU VLSI LTD
FUJITSU VLSI LTD
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Tadahiko Ito
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