Title:
半導体製造装置、半導体製造装置のパラメータ編集方法、半導体製造装置の表示方法
Document Type and Number:
Japanese Patent JP4536178
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor, capable of implementing setup at the time of its installation and before its start and a reduction in the process evaluation time when a user makes a process evaluation. SOLUTION: In modifying specific hardware-dependent parameters which have already been set, apparatus parameters 115 are divided into a file group 11 of apparatus parameters requiring restart of a system and a file group 12 of apparatus parameters which do not require restart of the system, and these parameters are modified at a desired stage after an operator has checked the displayed contents.
Inventors:
Hiroshi Kotani
Application Number:
JP5448199A
Publication Date:
September 01, 2010
Filing Date:
March 02, 1999
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/02; G06F3/048; G06F3/0481; G06F3/0488
Domestic Patent References:
| JP9306825A | ||||
| JP9248739A |
Attorney, Agent or Firm:
Hideo Akazawa
Mitsue Haba
Hisako Ishido
Mitsue Haba
Hisako Ishido