Title:
半導体製造装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7299728
Kind Code:
B2
Abstract:
An objective of the present invention is to provide technology capable of reflecting light of an illumination and preventing the light being inputted into a camera even when the flatness of a surface of a wafer or a die is not maintained. A semiconductor manufacturing device comprises: an imaging device imaging a die; an illumination device irradiating the die with light at a predetermined angle with respect to an optical axis of the imaging device; and a control unit controlling the imaging device and the illumination device. The predetermined angle is an angle that the light irradiated from the illumination device does not enter the imaging device even if the light is directly reflected from the die when the die is flat. When the die is not flat, the control unit is configured to move at least one of the imaging device, the illumination device, and the die so that the light irradiated from the illumination device is directly reflected from the die and the light does not enter the illumination device.
Inventors:
Kobashi Hideharu
Koji Hosaka
Koji Hosaka
Application Number:
JP2019055460A
Publication Date:
June 28, 2023
Filing Date:
March 22, 2019
Export Citation:
Assignee:
Fasford Technology Co., Ltd.
International Classes:
H01L21/52
Domestic Patent References:
| JP2018011048A | ||||
| JP8327554A | ||||
| JP2014215217A |
Attorney, Agent or Firm:
Polaire Patent Attorneys Corporation