半導体製造装置 - Toshiba Memory Corporation

Title:

半導体製造装置

Document Type and Number:

Japanese Patent JP6313250

Kind Code:

B2

More Like This:

WO/2017/048388	COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
WO/2017/172010	LEADFRAME TOP-HAT MULTI-CHIP SOLUTION
JPS55153355	STORING METHOD OF IC DEVICE AND CARRIER FOR THE DEVICE

Inventors:

Tatsuhiko Miura
Kazuhiro Murakami

Application Number:

JP2015048200A

Publication Date:

April 18, 2018

Filing Date:

March 11, 2015

Export Citation:

Assignee:

Toshiba Memory Corporation

International Classes:

H01L23/00; C23C14/35; C23C14/50; H01L21/56; H01L23/28; H05K9/00

Domestic Patent References:

Attorney, Agent or Firm:

Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi

Previous Patent: 処理システムの運転方法

Next Patent: IRON-BASED METALLIC NONWOVEN FABRIC AND ITS PRODUCTION