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Title:
SEMICONDUCTOR MANUFACTURING SYSTEM
Document Type and Number:
Japanese Patent JPH05128276
Kind Code:
A
Abstract:

PURPOSE: To provide a semiconductor manufacturing system capable of performing an inexpensive processing for changes of the content of measurement data in a semiconductor measurement data processing system.

CONSTITUTION: The data obtained in a semiconductor measurement device 1 is filed as it is unworked in a disk device 12 of a data processing system 9 from printer interfaces 8a, 8b, a repeating system 13 via a personal computer 10 by using the software to be outputted from a control system 2 to a printer 7a. This filed data is worked by the working software of a data processing system 9 and is outputted to a CRT 11 and a printer 7b.


Inventors:
HIGAKI OSAMU
Application Number:
JP28840191A
Publication Date:
May 25, 1993
Filing Date:
November 05, 1991
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G06F17/40; (IPC1-7): G06F15/74
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)



 
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