Title:
印刷回路基板を含む半導体モジュール
Document Type and Number:
Japanese Patent JP7486955
Kind Code:
B2
Abstract:
A device may include a substrate having a first surface and a second surface, a first conductive terminal disposed over the first surface, a second conductive terminal spaced apart from the first conductive terminal in a first direction and disposed over the first surface, a first conductive auxiliary pattern disposed below the first conductive terminal and overlapping with the first conductive terminal, the first conductive auxiliary pattern being coupled to the second conductive terminal, and a second conductive auxiliary pattern disposed below the second conductive terminal and overlapping with the second conducive terminal, the second conductive auxiliary pattern being coupled to the first conductive terminal.
Inventors:
Choi Kyuyoung
Bae Jin-ho
Choi Yoo-jeong
Bae Jin-ho
Choi Yoo-jeong
Application Number:
JP2020002010A
Publication Date:
May 20, 2024
Filing Date:
January 09, 2020
Export Citation:
Assignee:
SK hynix Inc.
International Classes:
H01L23/12; H01L25/04; H01L25/18
Domestic Patent References:
| JP2016515370A | ||||
| JP2008198846A |
Foreign References:
| US20180007782 |
Attorney, Agent or Firm:
Saegusa International Patent Office
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