SEMICONDUCTOR MODULE

Title:

SEMICONDUCTOR MODULE

Document Type and Number:

Japanese Patent JP2010123839

Kind Code:

A

Abstract:

To provide a semiconductor module which has shield effect, and is adaptive to height reduction and has high reliability.

The semiconductor module 1 includes a module substrate 10 having an electronic component 20 mounted on a top surface, a plane type top plate 30 arranged on the top-surface side of the module substrate 10 to cover the electronic component 20, and an elastic member 40 arranged between the top plate 30 and electronic component 20, and having an elastic function. The elastic member 40 is made of a sheet type low-elasticity resin, and fixed in advance to a surface of the top plate 30 which faces the electronic component 20. Then the top late 30 is fixed to the electronic component 20 by the elastic member 40. Further, the top plate 30 has a composite structure including a base portion 31 made of a glass epoxy material, a conductive foil 32 formed on the base portion 31, and an insulating layer 33 formed on the base portion 31 while covering the conductive foil 32, and made of solder resist.

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Inventors:

KUSHINO MASAHIKO
MURAKAMI MASAHIRO
YAMAMOTO SEIICHI

Application Number:

JP2008297684A

Publication Date:

June 03, 2010

Filing Date:

November 21, 2008

Export Citation:

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Assignee:

SHARP KK

International Classes:

H01L25/00; H01L23/00; H05K9/00

Domestic Patent References:

JP2003243567A	2003-08-29
JP2000216582A	2000-08-04
JP2004235617A	2004-08-19

Attorney, Agent or Firm:

Shizuo Sano
Inoue On

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