Title:
SEMICONDUCTOR-MOUNTING BOARD
Document Type and Number:
Japanese Patent JPH1167962
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor-mounting board, which is applied for mounting a center pad type semiconductor chip. SOLUTION: A semiconductor mounting board has a plurality of end surface electrodes 3, which are exposed outward extending over the thickness direction of the board, on the side surfaces of the outer periphery. The board has a structure, wherein a first insulating board 1 provided with a first through-hole 10 which is smaller than a semiconductor chip 4 to be mounted in the center part thereof is superposed on a second insulating board 2, provided with a second through-hole 20 larger than the hole 10 in the center part thereof. The end surface electrodes 3 respectively lie astride both side surfaces of these two insulating boards 1 and 2.
Inventors:
HIRATA ISAO
Application Number:
JP22862697A
Publication Date:
March 09, 1999
Filing Date:
August 25, 1997
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L23/12; H05K1/00; H05K1/14; H05K3/34; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)
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