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Title:
SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2013074249
Kind Code:
A
Abstract:

To provide a semiconductor package (P) capable of reducing the cost and the size thereof while ensuring the versatility of a high-frequency power amplifier.

A semiconductor package (P) includes: a ground conductor (131); two layers of high-frequency substrates (130) provided on the upper part of the ground conductor (131); and a pair of conductors (134) provided so as to sandwich the upper layer of the high-frequency substrate (130). A high-frequency power amplifier (100) includes the semiconductor package (P).


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Inventors:
MORINO YOSHIAKI
Application Number:
JP2011214353A
Publication Date:
April 22, 2013
Filing Date:
September 29, 2011
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/12; H03F1/07; H03F3/213; H03F3/26; H03F3/60; H03F3/68
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara



 
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