Title:
半導体パッケージ
Document Type and Number:
Japanese Patent JP6584258
Kind Code:
B2
Abstract:
A semiconductor package includes a package base substrate, at least one first semiconductor chip disposed on the package base substrate, and at least one stacked semiconductor chip structure disposed on the package base substrate adjacent to the at least one first semiconductor chip. The at least one stacked semiconductor chip includes a plurality of second semiconductor chips. A penetrating electrode region including a plurality of penetrating electrodes is disposed adjacent to an edge of the at least one stacked semiconductor chip structure.
Inventors:
Zhao Cha
Appointment
Zhao Tai
Appointment
Zhao Tai
Application Number:
JP2015187642A
Publication Date:
October 02, 2019
Filing Date:
September 25, 2015
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L25/065; H01L23/36; H01L25/04; H01L25/07; H01L25/18
Domestic Patent References:
| JP2013045863A | ||||
| JP2015502663A | ||||
| JP2008113010A |
Foreign References:
| US20140048947 | ||||
| US20130141858 | ||||
| WO2008108334A1 |
Attorney, Agent or Firm:
Kyosei International Patent Office