Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPS61220447
Kind Code:
A
Abstract:
PURPOSE: To perform solder connection efficiently, by performing surface treatment, in which the solder does not adhere to the inner surface of an external lead.
CONSTITUTION: A terminal 5 is extended to the bottom surface from the upper surface of a substrate 1 through the side surface. A gap 6 is provided at the side surface and the bottom surface of the substrate. A surface treated layer 9 is provided so that solder does not adhere to the inside of the terminal 5. The layer 9 is formed by using a resin coat, evaporation of Al, selected plating and clad materials of Cu and Al. Owing to the layer 9, the gap 6 is not filled with the solder, and the soldering is easy.
Inventors:
NIWA MITSUYUKI
Application Number:
JP6066085A
Publication Date:
September 30, 1986
Filing Date:
March 27, 1985
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H05K1/18; H01L23/32; H01L23/498; H01L23/50; H05K3/34; (IPC1-7): H01L23/12; H01L23/48; H05K3/34
Domestic Patent References:
| JPS59129448A | 1984-07-25 | |||
| JPS4989158A | 1974-08-26 | |||
| JPS59219946A | 1984-12-11 |
Attorney, Agent or Firm:
Katsuo Ogawa