Title:
SEMICONDUCTOR PELLET AND SEMICONDUCTOR DEVICE FOR SEALING THE SAME
Document Type and Number:
Japanese Patent JPH07263467
Kind Code:
A
Abstract:
PURPOSE: To raise adhesive force of an Si substrate of a semiconductor pellet with a metallized layer and to enhance reliability of a semiconductor device which seals the pellet.
CONSTITUTION: A semiconductor pellet 5 has a metallized layer 8 having wettability with a brazing material and formed on a rear surface of an Si substrate 6, and comprises an alloy layer 9 formed on a boundary between the rear surface of the substrate 6 and the layer 8 and formed by diffusing atoms of the substrate 6 and the layer 8 and reacting them.
Inventors:
AKASAKI HIROSHI
MIWA TAKASHI
MIWA TAKASHI
Application Number:
JP5149494A
Publication Date:
October 13, 1995
Filing Date:
March 23, 1994
Export Citation:
Assignee:
HITACHI LTD
HITACHI VLSI ENG
HITACHI VLSI ENG
International Classes:
H01L21/60; H01L21/52; (IPC1-7): H01L21/52; H01L21/60
Attorney, Agent or Firm:
Akita Aki
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