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Patent Searching and Data


Title:
SEMICONDUCTOR PRESSURE SENSOR DEVICE
Document Type and Number:
Japanese Patent JPS5819526
Kind Code:
A
Abstract:

PURPOSE: To obtain the device which is not adversely affected by pulsation and the like in a simple constitution, by providing an orifice part in a path including a hose which relays a pressure to be measured and pressurized air intake end of the semiconductor pressure sensor.

CONSTITUTION: An air intake manifold 1 is connected to a rubber hose 2A. The other end of said rubber hose 2A is connected to the air intake end part 3B of the semiconductor pressure sensor 3 having a pressure sensitive part 3A. The orifice 5 is formed on the manifold side of said air intake end part 3B so as to form a unitary body. In the case, e.g., the length of the hose 3 is 30cmW100cm, the diameter is 8mm, the length of the air intake end part 3B is 17mm, and the internal diameter is 4mm, the distance of the orifice is made to be 0.8mm. In this constitution, the removal or reduction of the pulsation in the sucked air becomes possible.


Inventors:
HASEGAWA TAIJI
Application Number:
JP11702881A
Publication Date:
February 04, 1983
Filing Date:
July 28, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G01L9/00; G01L19/00; G01L23/24; (IPC1-7): G01L9/00; G01L23/24
Attorney, Agent or Firm:
Masami Akimoto