Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JPH04131725
Kind Code:
A
Abstract:
PURPOSE:To reduce the influence on a soldering part of a thermal stress and improve its reliability by forming a buckled stress moderating part on a lead terminal after mounting a socket. CONSTITUTION:When the environmental temperature is changed in the mounting part of an engine controller, a hybrid circuit board 35 and a socket 46 are thermally expanded to generate a thermal stress in which the socket 46 relatively presses a lead terminal 42 and the hybrid circuit board 35. Then, the horizontal frame 48 of the socket 46 is relatively pressed to the clip part 43 of the lead terminal 42, and according to this, the lead terminal 42 is pulled to extend a stress moderating part 45, and by this extension of the stress moderating part 45, the thermal stress is moderated. Therefore, the stress by thermal expansion is prevented from collectively acting on a soldering part 62 which is the joint part between the lead terminal 42 and the circuit board 60 of the engine controller, and the reliability of the soldering part 62 is improved.
Inventors:
ASANO SHOGO
MORIKAWA TAKASHI
MORIKAWA TAKASHI
Application Number:
JP25328690A
Publication Date:
May 06, 1992
Filing Date:
September 21, 1990
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01L9/04; G01L9/00; H01L29/84; H05K3/30; (IPC1-7): G01L9/04; H01L29/84
Attorney, Agent or Firm:
Akira Kobiji (2 outside)