Title:
SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
Japanese Patent JP2000109647
Kind Code:
A
Abstract:
To provide a semiconductor sealing resin composition excellent in moldability, reliability and flame retardance which does not contain a bromine type flame retardant and antimony, and a semiconductor device using the same.
Semiconductor elements are sealed with a sealing medium comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a metal hydrate, and (E) an inorganic filler as the essential components, the metal hydrate (D) having a center particle diameter of 14-25 μm with not more than 30 wt.% particles having a particle diameter of not greater than 10 μm and not more than 5 wt.% particles having a particle diameter of not greater than 5 μm.
Inventors:
FUJII MASANOBU
ODA TOMOICHI
CHIHAMA JUNICHI
ODA TOMOICHI
CHIHAMA JUNICHI
Application Number:
JP28517798A
Publication Date:
April 18, 2000
Filing Date:
October 07, 1998
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K3/22; C08G59/68; C08K9/04; C08K9/06; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/68; C08K3/22; C08K9/04; C08K9/06; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kunihiko Wakabayashi