Title:
SEMICONDUCTOR SEALING METHOD
Document Type and Number:
Japanese Patent JPH10163239
Kind Code:
A
Abstract:
To enable continuously performing semiconductor sealing for a long time by injection molding of low pressure and low speed which uses epoxy resin sealing material for injection molding.
A lead frame to which a semiconductor element is wirebonded or lead wires to which a semiconductor element is bonded are fixed, as an insert, to an injection molding die. An epoxy resin sealing material for injection molding whose inevitable components are epoxy resin, phenol resin hardener, hardening promotor and inorganic filler is injected into the metal mold, under the controlled condition that the injection speed is so low as to be 0.3-50mm/sec and the injection pressure is so low as to be 30-175kgf/cm2.
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Inventors:
ITO HIDEO
YOSHIZUMI FUMINARI
MINAMI KATSUNORI
YOSHIZUMI FUMINARI
MINAMI KATSUNORI
Application Number:
JP31676096A
Publication Date:
June 19, 1998
Filing Date:
November 27, 1996
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B29C45/14; B29C45/50; B29C45/77; H01L21/56; H01L23/29; H01L23/31; B29K63/00; B29L31/34; (IPC1-7): H01L21/56; B29C45/14; B29C45/50; B29C45/77; H01L23/29; H01L23/31
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