Title:
SEMICONDUCTOR SENSOR
Document Type and Number:
Japanese Patent JP2017207408
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor sensor in which a thin-film part does not break down at the time of dicing or when it is used in such a way that the thin-film part is subjected to excessive pressure.SOLUTION: A semiconductor sensor 1 is configured to include: a base part 10; a semiconductor substrate 11 in which at least one open hole 111 is formed, and one face of which is fixed to the base part; a thin-film part 12 formed on the other face of the semiconductor substrate, covering at least a portion of the open hole and having a sensor formed therein; and a support 13 accommodated within the open hole, with a space away from the thin-film part fixed to the base part.SELECTED DRAWING: Figure 1
Inventors:
FUJIMOTO TAKAHIRO
Application Number:
JP2016101013A
Publication Date:
November 24, 2017
Filing Date:
May 20, 2016
Export Citation:
Assignee:
NISSHA PRINTING
International Classes:
G01N27/12; G01L1/20; G01L9/00; G01P15/08; G01P15/12; H01L29/84
Domestic Patent References:
| JP2004184373A | 2004-07-02 | |||
| JP2002098709A | 2002-04-05 | |||
| JP2007199011A | 2007-08-09 | |||
| JP2009210324A | 2009-09-17 |
Foreign References:
| US20130167640A1 | 2013-07-04 |