Title:
SEMICONDUCTOR TESTING DEVICE, PROBE NEEDLE THEREOF, AND PLATE OF SEMICONDUCTOR LASER TESTING DEVICE
Document Type and Number:
Japanese Patent JP2005123248
Kind Code:
A
Abstract:
To prevent a semiconductor laser chip from adhering to a probe needle or a plate for chip mounting.
The semiconductor laser chip 11 is pinched by the probe needle 15 wherein a plating layer 12 composed of nickel or chromium in which gold is hard to perform self diffusion is formed on the surface of a copper substrate, and a metal block 14 wherein a plating layer 13 composed of nickel or chromium in which gold is hard to perform self diffusion is formed on a surface of the block. In the case of testing to the semiconductor laser chip 11, the adherence of the chip 11 to the probe needle 15 or the metal block 14 caused by the self diffusion of gold is prevented.
Inventors:
OSAKI HIROTO
TANAKA SHOICHI
TAMURA YOSHIKAZU
TANAKA SHOICHI
TAMURA YOSHIKAZU
Application Number:
JP2003353665A
Publication Date:
May 12, 2005
Filing Date:
October 14, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01R1/067; H01S5/00; (IPC1-7): H01S5/00; G01R1/067
Attorney, Agent or Firm:
Mitsutake Murayama
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