PURPOSE: To obtain a semiconductor wafer carrier and a chucking device of a semiconductor wafer wherein the semiconductor wafer is sucked to the semiconductor carrier when it is put in this carrier, and vacuum chucking is executed, and which enable thus improvement of the safety and reliability for carriage of the semiconductor wafer.

CONSTITUTION: In a semiconductor wafer carrier wherein a plurality of semiconductor wafer holding grooves are formed for holding semiconductor wafers respectively and the semiconductor wafers in a plurality can be held therein, holes 18 for vacuum chucking which are formed in the vicinity of the individual semiconductor wafer holding grooves 13 respectively, vacuum lines made to communicate with these holes 18 for vacuum chucking respectively and a vacuum line connecting port made to communicate with these vacuum lines and formed in the lower part of the semiconductor wafer carrier 11 are provided.