Title:
SEMICONDUCTOR WAFER REPLACING DEVICE
Document Type and Number:
Japanese Patent JPH04352449
Kind Code:
A
Abstract:
PURPOSE: To eliminate damage of a semiconductor wafer, adherence of dusts to the wafer by replacing the wafer in a carrier to be used for manufacturing steps from a case with a bottom without using a fork, an attraction plate.
CONSTITUTION: There are provided base plates 2, 3 for fixing a case 5 containing a wafer 7 and a vacant carrier 6 is such a manner that their openings face; a rotary base 1 for reversing them at 180 degree, and a pusher 4 for controlling a speed of own-weight dropping of the wafer 7 at the time of reversing and replacing it in the carrier without impact.
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Inventors:
SUGAWARA ICHIRO
Application Number:
JP12637391A
Publication Date:
December 07, 1992
Filing Date:
May 30, 1991
Export Citation:
Assignee:
NEC YAMAGATA LTD
International Classes:
B25J1/08; B65H9/10; H01L21/677; H01L21/68; (IPC1-7): B25J1/08; B65H9/10; H01L21/68
Domestic Patent References:
| JPH02123750A | 1990-05-11 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)